Vertical injection molding machine
1、High speed is mainly reflected in the injection of glue, can choose high speed and high pressure for injection.
2、Using the energy storage device, the maximum injection speed can reach 500mm/sec.
3、Rapid injection, precise molding, short production cycle.
4、It is suitable for the best and most stable choice for the ultra-thin molding products under 0.2mm meat thickness.
5、Computerized automatic fault display, convenient troubleshooting and maintenance.
6、All imported hydraulic parts and electronic control, fast response, stable and durable.
Specific Load
12'' Foup Pod
Specific Load
12'' Foup Pod
Specific Load
12'' Foup Pod
Specific Load
12'' Foup Pod
Description
Specialized for semiconductor scene, transporting FOUP POD
The OW12 comes with a cobot that’s designed to handle and load/unload 12″ FOUP PODs in semiconductor front-end chip manufacturing scenarios. The cobot has an end gripper and vision sensor that can accurately grasp the 12″ FOUP POD at the upper clamping fixture, reducing direct contact with wafers and minimizing vibration impact during lifting. The robot is designed to minimize vibration impact on the handling object FOUP POD, meeting the conventional standard of vibration ≤ 0.5G for flat ground operation. With the specially designed electronic shelf, it can handle material from the robot storage position to the shelf storage position while monitoring and uploading the robot and shelf storage position information.
Multidirectional radar detection ensures safety during operation
The OW12 is a mobile manipulator composed of a P200 base chassis integrated with multiple sensors and HMI. In addition to the P200’s 360° plane scanning for obstacle detection and navigation, the upper integrated box structure of the OW12 is equipped with two additional lidars for vertical plane scanning. This feature prevents the risk of material damage due to obstacles of the same height touching the OW12’s storage position during operation.
Flexible deployment for quick start-up
Equipped with MOS – an integrated cobot control system developed by YOUIBOT that seamlessly integrates the upper system of the cobot and multiple end sensing control systems into Ow12 internal operating system. This integration significantly reduces the cost and time associated with switching between multiple systems during deployment. With a more convenient workflow and log record for the entire machine control system, OW12 ensures action traceability during its operation, making it a reliable and efficient choice for various industries.
- Planar and vertical safety scanning providing reliability in semiconductor scenario operation;
- Self-developed cobot and end control integration system MOS;
- Storage level monitoring function provided by specially designed electronic material rack;
- HMI interface on the integrated box structure for real-time operator inspection;
- Contribute to Industry 4.0 automation transformation in the semiconductor industry.
Application Scenario
The OW series of collaborative robots are custom designed for wafer handling scenarios in the semiconductor industry. Featuring integrated robotic arms, end clamps, and sensors, they provide stable and precise gripping of FOUP PODs, enabling them to be accurately placed on the body storage position. To further reduce the cost of production errors, specially designed electronic shelves equipped with sensors ensure FOUP POD traceability. With the OW series, unnecessary production errors can be avoided, resulting in a more cost-effective and efficient semiconductor manufacturing process.
Related Products
OW8
specifically designed for loading and transferring 8” Foup Pods.
In addition to basic AMR safety horizontal detection, OW8 is equipped
with a safety and navigation lidar, as well as a side lidar that provides
vertical detection.
This advanced technology supports the semiconductor industry’s push
for greater automation in manufacturing, allowing for more efficient and
effective processes.
With OW8, manufacturing operations can be streamlined, resulting in
increased productivity and reduced costs.
OW8
specifically designed for loading and transferring 8” Foup Pods.
In addition to basic AMR safety horizontal detection, OW8 is equipped
with a safety and navigation lidar, as well as a side lidar that provides
vertical detection.
This advanced technology supports the semiconductor industry’s push
for greater automation in manufacturing, allowing for more efficient and
effective processes.
With OW8, manufacturing operations can be streamlined, resulting in
increased productivity and reduced costs.