Automatic double head terminal machine

➢Support OTP straight/horizontal mold, easy to replace the card-type mold seat
➢Real-time monitoring of air pressure, wire kinking, lack of wire, playing the end of the abnormal, real-time monitoring
➢32-bit CORTEX-M3 kernel processor + large easy FPGA logic processing chip dual-core structure

Application Scenario

The OW series of collaborative robots are custom designed for wafer handling scenarios in the semiconductor industry. Featuring integrated robotic arms, end clamps, and sensors, they provide stable and precise gripping of FOUP PODs, enabling them to be accurately placed on the body storage position. To further reduce the cost of production errors, specially designed electronic shelves equipped with sensors ensure FOUP POD traceability. With the OW series, unnecessary production errors can be avoided, resulting in a more cost-effective and efficient semiconductor manufacturing process.

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